Joined metal composite and method for production thereof
US4985097A · kind A · utility
22Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Jun 16, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a joined ceramic-metal composite having a copper sheet directly joined to a ceramic substrate and a method for the production thereof. This composite is characterized by having a plurality of parallel grooves formed on the surface of the copper sheet to be joined to the ceramic substrate. The products of this invention show substantially none of the defects such as blisters inflicated on the copper sheet during the course of union by heating and, therefore, serve advantageously as ceramic circuit substrates for use in transistor modules, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.