Three dimensional plating or etching process and masks therefor
US4985116A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1990 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Feb 23, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1028
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a process for plating or etching metalization patterns on the surface of a three dimensional substrate, a flexible plastic mask is fabricated by first coating the surface of a thin plastic sheet with vacuum formable ink. The mask is then molded into the shape of the surface into which the pattern is to be formed. A low power YAG laser is used to remove areas of the ink through which light is to be allowed to pass. This mask may then be used in either a print and plate process or a print and etch process by drawing the mask into intimate contact with the workpiece by applying a vacuum between the mask and the workpiece. The workpiece may then be exposed to light through the clear areas of the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.