Printed wiring board
US4985294A · kind A · utility
11Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Aug 24, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Composite films for use in printed wiring boards are comprised of an insulating layer and a copper foil laminated thereover, the insulating layer being made up predominantly of a selected epoxy resin and a selected acrylonitrile-butadiene rubber, whereby voidlessness, thickness uniformity and insulation adjustment are enhanced. Also disclosed is a method of producing a printed wiring board using the film by a subtractive process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.