Hardenable resin composition
US4985474A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Nov 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0759
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin composition hardenable by irradiation of a high energy ray is disclosed, which includes: PA1 (a) a resin selected from the group consisting of rosins and modified rosins and having an acid value of at least 150 and a Gardner color scale of not greater than 15; PA1 (b) a compound of the general formula (I): EQU Y--CO--O--A--O).sub. m CO--CR.dbd.CH.sub.2 (I) PA1 wherein Y represents ##STR1## A represents an alkylene having 1-4 carbon atoms, R represents hydrogen or methyl and m is an integer of 1-4; PA1 (c) a hydroxyl group-containing compound having only one acrylic or methacrylic group and at least one hydroxyl group; and PA1 (d) a polyol compound having at least two hydroxyl groups. The resin composition is useful for plugging through-holes of a metal plated board in manufacturing printed wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.