Thermosetting epoxy resin composition
US4985530A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Jul 27, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/5033
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A new thermosetting resin composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of smaller than 650 but not smaller than 450 and a ratio of the weight average molecular weight thereof to the number average molecular weight thereof of in the range of 1.3-3.0; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.