Polyetheramide hotmelt-adhesives
US4985534A · kind A · utility
8Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1990 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Feb 2, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to modified polyetheramide hotmelt adhesives showing reduced melt viscosity and, optionally, better adhesive properties and to their use as ingredients for hotmelt adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.