Patent · US Expired

Polyetheramide hotmelt-adhesives

US4985534A · kind A · utility

8Cited by
1References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 2, 1990
Grant dateJan 15, 1991
Priority date
Expiry dateFeb 2, 2010

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L101/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

This invention relates to modified polyetheramide hotmelt adhesives showing reduced melt viscosity and, optionally, better adhesive properties and to their use as ingredients for hotmelt adhesives.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.