Moisture-curable hot-melt adhesive composition
US4985535A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Nov 14, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A moisture-curable hot-melt adhesive composition comprising a reaction product obtainable by reacting (A) a mixture of (a) a high molecular weight thermoplastic polyester component predominantly composed of a hydroxy-terminated high molecular weight polyester containing a hydrocarbon chain with a molecular weight of 600 to 6,000 and having a molecular weight of 8,000 to 25,000 and (b) a low molecular weight polyol having a molecular weight of not more than 5,000 with (B) a polyisocyanate compound in an NCO/OH ratio of 1.4 through 3. This moisture-curable hot-melt adhesive composition is useful for the adhesion at a low temperature, and shows an excellent heat resistance and initial physical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.