Printed circuit board having an injection molded substrate
US4985600A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 13, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Sep 13, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes an injection molded substrate having a pattern recessed in the substrate surface of interconnect traces, through-connections and contact rods. A trench-shaped depression is provided in the substrate surface in the region of each interconnect trace, and a planar depression is provided in the substrate surface in at least one of (a) the region of each through-connection and (b) the region of each contact surface. The pattern of recesses is covered with a conductive metal coat, and the width of each trench-shaped depression is dimensioned narrowly in comparison of the width of each planar depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied, such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.