Thermal head
US4985712A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1989 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Oct 26, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3357
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head of this invention has an improved protective layer on the head surface. The protective layer comprises a compound containing Si, O, N, and a metal M (wherein M is at least one metal selected from the group consisting of Zr, Mg, and Y). The protective layer has high hardness and toughness and does not deform much nor crack if a local concentrated load acts on it during operation of the thermal head. In the thermal head of this invention, the protective layer and a high-resistance substrate comprises a material having high hardness such as a metal, an alloy, or a ceramic protect various interlayers formed therebetween. Even if a layer comprising a material having low hardness such as a heat insulating layer comprising a heat-resistant resin is included as an interlayer, deformation or a crack caused by a local stress acting on the thermal head can be prevented. The protective layer can be produced at a higher sputtering rate than that of a conventional SIALON film or the like and therefore is superior in a mass-production property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.