Device for the cooling of optoelectronic components and use of a flange joint used thereof

US4985805A · kind A · utility

Assignees

• Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US
• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang Riedel · Neuenbürg, DE
• Richard Wissler · Glückstadt, DE
• Otmar Fichter · March, DE
• Klaus Gregorius · Copenhagen, DK
• Gerhard Mattauch · Kleinsendelbach, DE
• Heinz Schorner · Westerburg, DE

Key dates

• Filing date: Jul 21, 1988
• Grant date: Jan 15, 1991
• Expiry date: Jul 21, 2008

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/0222
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In a device for the cooling of optoelectronic components (1) with an evacuated cooler housing mounted on a base, in which there are provided at least one holding device for components (1) which is thermally coupled with the cold station of a cooling unit through at least one flexible metal band (19), the housing of the cooling unit is for vibrational decoupling connected with the cooler housing and sealed against atmospheric pressure through ring-shaped rubber-elastic sealing means. The at least one holding device (8), through a flexible metal band (19) thermally coupled to a cold station, of a refrigeration unit, that protrudes into the cooler housing, comprises a retaining plate (17) which is arranged on one end of a thin-walled, essentially prismatic or cylindrical body from a thermally poorly conductive material, specifically epoxy resin panels (9, 10, 11, 12). The end of the epoxy resin panels (9, 10, 11, 12) opposite the retaining plate (17) is rigidly mounted on the base of a cooler housing through a metallic base (13).