Thin-film coating apparatus
US4986873A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 1989 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Jan 30, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1734
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin-film coating apparatus for coating a surface of a substrate with a thin film wherein the creation of void spaces can be prevented on the contacting surfaces between the laminated film and the electrically conductive layer formed on a substrate. The apparatus includes wet rollers which are arranged along the substrate conveyace path prior to a tacking position where the thin-films are temporarily tacked to the substrate. The wet rollers deposit a void preventing agent on the substrate so as to provide a secure lamination. So as to insure that the agent will be supplied to the wet rollers, the apparatus includes supply pipes, flexible dams, means for supplying the agent to the supply pipes and a plurality of holes formed in the supply pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.