Electroplating apparatus for plate-shaped workpieces
US4986888A · kind A · utility
17Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1989 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Jun 8, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroplating device for sheet-like circuit boards characterized by an upper and lower electrode extending on opposite sides of a path for the boards, electrolyte headers being arranged adjacent the inlet and the outlet of the apparatus above and below the path for the boards and wash jets being arranged above the path for discharging electrolyte solution vertically against the boards as they pass therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.