Chemical vapor processing method for deposition or etching on a plurality of substrates
US4987005A · kind A · utility
20Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1989 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Aug 21, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved method for manufacturing uniform films or etching uniformly on a plurality of substrates is shown. The substrates are vertically placed in a reaction chamber so as to be treated at once. A chemical vapor reaction takes place by virtue of a high frequency electric power which is modulated in its amplitude. By this modulation, the deposition or etching can be carried out over the surface of a susbtrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.