Diacetylene compound having double bond and shaped article thereof
US4987257A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1990 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Feb 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F38/00
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a diacetylene compound comprising, as structural units, (a) at least one member selected from diacetylene group-containing organic groups of the formulae (I) and (II): EQU R.sup.I --C.tbd.C--C.tbd.C--R.sup.II -- (I) and EQU --R.sup.III --C.tbd.C--C.tbd.C--R.sup.IV -- (II) wherein R.sup.I is hydrogen or a (C1-16) monovalent organic group, and R.sup.II, R.sup.III and R.sup.IV are a (C1-13) divalent organic group, (b) at least one organic group having at least one carbon-to-carbon double bond, and (c) at least one connecting group connecting the units (a) and (b), which connecting group is selected from amide, imide, ester, ether, amino, imino, urethane, sulfonyl and carbonyl bonds. A cured shaped article made of this compound exhibits isotropically a high elastic modulus and has excellent mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.