Micro individual integrated circuit package
US4987478A · kind A · utility
20Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 1990 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Feb 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An hermetic integrated circuit package having a single die wherein wire connections to area pads on the active face of the die are carried through an hermetic boundary comprised of a cover plate to an external interface with the next succeeding interconnect level. The package is comprised of a heat exchange element to which the die is attached, a cover plate having holes homologously positioned with respect to the area pads on the die and a seal ring for joining the heat exchange element to the cover plate. The wire connections which are carried through the holes and sealed to the cover plate are externally accessible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.