Method of liquid phase diffusion bonding of metal bodies
US4988035A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1989 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Sep 5, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/302
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Insert 1 comprises thin substrate made by cold-rolling, and two bonding alloy layers formed by plating on the upper and lower surfaces of substrate, respectively. Both layers is extremely thin, and is made of an alloy having a melting point lower than that of substrate. Insert 1 is used to achieve liquid phase diffusion bonding of first and second base metals. Insert 1 is interposed between first base metal and second base metal. Then, insert 1 and base metals are clamped together with a pressure of, for example, 0.5 kgf/mm.sup.2, and are placed in a atmosphere of a low pressure of about 10.sup.-4 Torr and heated to the melting point of alloy layers or to a temperature above this melting point but below the melting points of substrate and plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.