Copper-tungsten metal mixture and process
US4988386A · kind A · utility
10Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1988 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Jun 29, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C1/045
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper-tungsten mixture net-shaped product produced using powder metallurgical techniques with injection molding and liquid phase sintering. The product has a very low leak rate in helium gas, a high thermal conductivity and a rate of thermal expansion which is substantially the same as some glass and ceramic materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.