Selective electrolytic desposition on conductive and non-conductive substrates
US4988412A · kind A · utility
24Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1988 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Dec 27, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Selective electrolytic deposition is provided on a body having a conductive surface comprised of two different conductive materials in which one of the conductive materials forms a surface layer upon exposure to a particular ambient environment and wherein that surface layer prevents electroplating on that material in the particular electroplating environment utilized for the electroplating of the desired pattern on the other conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.