Process and apparatus for depositing coatings of high electrical resistance by cathode sputtering
US4988422A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 1987 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Jun 8, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus for reactive sputtering of an electrically resistive coating onto a planar substrate includes a magnetron cathode with a planar target of a metal which forms one component of the coating. The reaction gas, which provides another component of the coating, is released as close as possible to the target, but outside of its outline. The distance "a" between the target surface and the substrate surface is less than 60 mm, and a mask system is provided at a distance "d" from the substrate which is less than half the distance "a". The density of reaction gas particles in front of the substrate is thus increased, resulting in a high deposition rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.