Light-sensitive resin composition and light-sensitive element
US4988605A · kind A · utility
6Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1989 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Mar 2, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a light-sensitive resin composition that has resistance to heat and chemicals, is particularly adapted for use in the formation of a protective film for chemical plating and which is also improved in resistance to the heat of soldering. This light-sensitive resin composition contains (a) a polyurethane (meth)acrylate, (aa) a bisphenol type epoxy (meth)acrylate, (b) a linear high-molecular weight compound, and (c) a polymerization initiator which generates free radicals upon exposure to light. This resin composition is applicable to the manufacture of printed circuit boards by the additive process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.