Semiconductor integrated circuit device having multilayer power supply lines
US4989062A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1988 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Jun 16, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device having multilayer power supply lines includes a plurality of power supply lines formed on a semiconductor chip for supplying power to the cells. The power supply lines are constructed by the multilayer structure having three different layer levels. First-level (lower) and third-level (upper) power supply lines are arranged in parallel so as to overlap each other. Second-level (intermittent) power supply lines are arranged in parallel so as to extend in a direction perpendicular to the first-level and third-level power supply lines. The overlapping first and third power supply lines are set at different potentials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.