Layered devices having surface curvature
US4989226A · kind A · utility
45Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1989 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Oct 23, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0005
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of treating a substrate having first and second sides with corresponding oppositely facing first and second surfaces, to produce curvature in the first surface. The method includes the steps of removing material, according to a predetermined pattern, from the second side of the substrate, and applying a stress-producing film of material to at least one surface of the substrate to thereby cause the substrate to bend to produce the desired curvature in the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.