Headphone cushioning
US4989271A · kind A · utility
100Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1989 |
| Grant date | Feb 5, 1991 |
| Priority date | — |
| Expiry date | Aug 24, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/15
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved cushion for use on a heater has a thin front skin formed with a circumferential groove. A thin flexible ring is attached to the circumferential groove. A flexible rear skin supports a foam ring and is sealed to the front skin so as to form a gel space. Structure, such as a retaining ring and mating holes and pins, attaches the cushion to the headset.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.