Thin film forming apparatus
US4989541A · kind A · utility
40Cited by
5References
7Claims
0Family size
Inventors
Key dates
| Filing date | Feb 14, 1990 |
| Grant date | Feb 5, 1991 |
| Priority date | — |
| Expiry date | Feb 14, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45582
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film forming apparatus includes, in addition to a material gas nozzle, a control gas nozzle for jetting a control gas flow which encircles a material gas flow jetted from the material gas nozzle against a substrate supported in a reaction chamber, so as to shape the material gas flow into the form of a beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.