Solvent-free, low-monomer or monomer-free polymerizable hot melt coating process

US4990364A · kind A · utility

Assignee

• 501 Schmalbach Lubeca AG · DE

Inventors

• Georg Bolte · Vechelde, DE
• Rudolf Hinterwaldner · Munich, DE

Key dates

• Filing date: Dec 4, 1987
• Grant date: Feb 5, 1991
• Expiry date: Dec 4, 2007

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09D167/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

There are described solvent-free, low monomer or monomer-free polymerizable melt compositions suitable for the corrosion and abrasion resistant coatings of substrates and formed bodies of metal, plastic, cellulose materials and/or inorganic materials and/or the creation of a protective film with barrier properties and methods of making them. The melt compositions are particularly useful especially for use in packaging, and comprise: (a) at least one polymerizable, hydroxyl-containing polymer having an average molecular weight (Mw) of between 1,000 and 500,000 and a glass transition temperature (Tg) of .gtoreq.+20.degree. C., and/or (b) at least one polymerizable, linear unbranched and/or branched polyester and/or its copolymer having an average molecular weight (Mw) of between 800 and 50,000 and a glass transition temperature (Tg) of .gtoreq.-50.degree. C., and/or (c) a polymerizable oligomer carrying an ethylenically unsaturated group, of the following group consisting of acrylic, methacrylic, ether, ester, urethane, amide, imide, epoxide, siloxane, phenol, novolak and/or mercapto compounds having an average molecular weight (Mw) of between 400 and 10,000, and (d) if required, con…