Patent · US Expired

Thermoplastic molding materials

US4990564A · kind A · utility

17Cited by

6References

8Claims

0Family size

Assignee

BASF SE

Inventors

Christof Taubitz · Monsheim, DE
Horst Reimann · Worms, DE
Klaus Boehlke
Hermann Gausepohl · Mutterstadt, DE
Christoph Plachetta · Schifferstadt, DE

Key dates

Filing date	Dec 15, 1988
Grant date	Feb 5, 1991
Priority date	—
Expiry date	Dec 15, 2008

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding materials containing, as essential components, PA1 (A) 5-95% by weight of a partially aromatic copolyamide essentially composed of PA2 (A.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine PA2 (A.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam and PA2 (A.sub.3) 0-80% by weight of units derived from adipic acid and hexamethylenediamine, PA1 (B) 5-95% by weight of a polyphenylene ether, PA1 (C) 0-45% by weight of a vinylaromatic polymer and PA1 (D) 0-40% by weight of a rubber impact-modifier, are prepared.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.