Apparatus for transmitting heat under vacuum by grains
US4990754A · kind A · utility
1Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1989 |
| Grant date | Feb 5, 1991 |
| Priority date | — |
| Expiry date | May 3, 2009 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2099/0066
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transmission apparatus is formed between a thermal source (12) and an object (21) in a vacuum enclosure (1) by placing in a cavity defined by a heat emission wall (20) and the object (21), a granular material (30) which adapts to the thermal expansions, while permitting heating by conductivity under very good conditions. Possible application to the manufacture of semiconductors and the crystallization of thin films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.