Chip card structure
US4990759A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1988 |
| Grant date | Feb 5, 1991 |
| Priority date | — |
| Expiry date | Dec 16, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for the fabrication of chip cards. These cards are flat and undergo a high degree of deformation under bending and twisting stresses, when the user does not take any special precautions in their use. A micromodule is housed in a cavity of the card, and this micromodule is fixed by the natural adhesion between the plastic material of the bottom of the cavity and the coating resin of the integrated circuit of the module. To prevent the micromodule from being torn off during a bending stress undergone by the card, there is provision for at least one overhang by which the upper surface of the card covers an edge of the micromodule to limit the movements of said micromodule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.