Vertically interconnected integrated circuit chip system
US4991000A · kind A · utility
Inventors
Key dates
| Filing date | Aug 31, 1989 |
| Grant date | Feb 5, 1991 |
| Priority date | — |
| Expiry date | Aug 31, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1627
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high density IC layout is achieved by providing conductive feedthroughs through an IC chip directly to input/output locations within the circuitry, inward from the periphery of the chip or alternately at the periphery of the chip. The chip can thus be mounted to a substrate face up, allowing for visual inspection and simplified mounting techniques. To provide a high density 3-D stack, substrates with chips mounted thereon are stacked together, with substrate feedthroughs connecting to selected chip feedthrough via the substrate routing, and successive layers electrically connected by contact springs. Chips mounted on a single substrate can also be used in a 2-D configuration, without substrate feedthroughs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.