Sensor elements in multilayer ceramic tape structures
US4991283A · kind A · utility
Inventors
Key dates
| Filing date | Nov 27, 1989 |
| Grant date | Feb 12, 1991 |
| Priority date | — |
| Expiry date | Nov 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure formed of a plurality of sheets which are laminated and fused together includes at least one sintered ceramic sheet formed from thermally fusible tape. A sensor element, such as a cantilever, circular diaphragm, rectangular diaphragm supported at least two sides, or microbridge, is formed as a part of the ceramic sheet. A hole may be formed through one of the sheets adjacent to the ceramic sheet to expose the sensor element to an ambient environment which is to be sensed. Electrical signals corresponding to a physical change in the sensor element such as stress or displacement are generated by piezoresistor, variable capacitor, photodetector, or the like attached to or formed on the sensor element, which is interconnected with a metallization pattern formed on at least one of the sheets. The thickness of the sheets is highly uniform, thereby producing sensor elements with precisely reproducible thicknesses and mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.