Thermally stable dual metal coated laminate products made from polyimide film
US4992144A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1989 |
| Grant date | Feb 12, 1991 |
| Priority date | — |
| Expiry date | Sep 27, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Both surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt and can also be coated with a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which serves the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating the porous metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.