Glass fibre-reinforced epoxide resin moulding composition and its use
US4992488A · kind A · utility
9Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 1, 1989 |
| Grant date | Feb 12, 1991 |
| Priority date | — |
| Expiry date | Sep 1, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49011
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxide resin moulding composition, comprising PA1 (a) a phenol or cresol novolak epoxide resin, PA1 (b) dicyandiamide as a hardener, PA1 (c) an accelerator suitable for hardening with dicyandiamide, PA1 (d) 20 to 70% by weight of calcium carbonate and PA1 (e) 10 to 60% by weight of glass fibres, the quantity of components (d) and (e) together not exceeding 80% by weight, relative to the total weight of the epoxide resin moulding composition, is suitable with advantage for the manufacture of commutators and slipring bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.