Semiconductor integrated circuit chip interconnections and methods
US4993622A · kind A · utility
1Cited by
13References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1988 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Feb 9, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to an electrical connection between a bonding pad on a semiconductor chip and a wire wherein the bonding pad is formed of copper doped aluminum and the wire is formed of copper doped gold. The wire has from about 100 to about 10,000 parts per million copper and the pad has from about 5000 to about 50,000 parts per million copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.