Thermoplastic film die attach adhesives
US4994207A · kind A · utility
9Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1989 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Mar 9, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A die attach adhesive film having excellent die shear strength is provided by a polysiloxaneimide having a weight average molecular weight of at least 100,000 and a aromatic diamine segment with substituents in the meta position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.