Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
US4994514A · kind A · utility
5Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1988 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Aug 5, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5406
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Electronic components can be encapsulated with a poly(arylene sulfide) composition containing a mercaptosilane such as, for example, 3-mercaptopropyltrimethoxysilane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.