Hydraulic thermal clamp for electronic modules
US4994937A · kind A · utility
41Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1989 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Dec 22, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1404
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a clamp for thermically clamping a circuit board module by its edge to spaced guide rails within an enclosure, the guide rails forming a channel for the module. In detail, the system includes at least one hollow closed off tube, filled with a fluid-like material, joined to the edge of the module, the at least one tube having a semi-flexible wall and a specific width and volume. A mechanism is mounted to the module for decreasing the volume of a portion of the at least one tube causing the remaining portion of the at least one tube to increase in width clamping the module between the guide rails.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.