Process for forming a metal compound coating on a substrate
US4995947A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1988 |
| Grant date | Feb 26, 1991 |
| Priority date | — |
| Expiry date | Jun 29, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D13/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of coating a substrate with a thin layer of a metal compound by forming a dispersion of an electrophoretically active organic colloid and a precursor of the metal compound in an electrolytic cell in which the substrate is an electrode. Upon application of an electric potential, the electrode is coated with a mixture of the organic colloid and the precursor to the metal compound, and the coated substrate is then heated in the presence of an atmosphere or vacuum to decompose the organic colloid and form a coating of either a combination of metal compound and carbon, or optionally forming a porous metal compound coating by heating to a temperature high enough to chemically react the carbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.