Method of depositing thin films consisting mainly of carbon
US4996079A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 17, 1989 |
| Grant date | Feb 26, 1991 |
| Priority date | — |
| Expiry date | Feb 17, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
While CVD (chemical vopour reaction) methods and enhanced CVD methods for coating a substrate with a carbon coating have recently been attracting considerable interest, there have occurred hitherto rubbing-off of the carbon coating from the underlying substrate due to differential thermal expansion or contraction. The present invention discloses a modification of the conventional CVD process for carbon deposition in accordance with which the deposition condition is changed in order that the hardness of the carbon coating at the interface between the coating and the underlying substrate is lower than that at the external surface of the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.