Patent · US Expired

Process for the production of a solder coating on metallized materials

US4996111A · kind A · utility

9Cited by

5References

7Claims

0Family size

Assignee

Hoechst Ceramtec AG · DE

Inventors

Tha Do-Thoi · Westerburg, DE
Klaus Popp · Nürnberg, DE

Key dates

Filing date	Jan 12, 1990
Grant date	Feb 26, 1991
Priority date	—
Expiry date	Jan 12, 2010

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/388
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A solder coating is applied to a metallized ceramic part in that at least two layers, in each case composed of nickel, copper, silver, zinc or tin, are applied chemically or galvanically. Under the soldering conditions molten solder metal forms on these layers. Useful layers for hard solders are those which are in each case composed of Ni, Cu or Ag. For example, a layer of nickel, copper or silver, with a layer thickness of at least 0.5 .mu.m, can be first applied to the metallized ceramic part, followed by at least one further layer of nickel, copper or silver with a layer thickness of 10-105 .mu.m, until a total layer thickness of 15-300 .mu.m is obtained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.