Device for interconnection and protection of a bare microwave component chip
US4996588A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 1989 |
| Grant date | Feb 26, 1991 |
| Priority date | — |
| Expiry date | Mar 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to interconnect an unprotected bare chip of MMIC (microwave monolithic integrated circuit), a ceramic substrate carries a double-face circuit. A network of microstrip lines which radiate from the center to the periphery is disposed on the first face of said double-face circuit. The bare MMIC chip and its microwave environment is fixed on the second face which is metallized as a ground plane. The microwave circuit is interconnected with the network of microstrips by means of plugged metallized holes. A sole-piece provided with a housing for the MMIC is fixed on the ground plane. The first face can carry self-protected components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.