Semiconductor module and cooling device of the same
US4996589A · kind A · utility
19Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1988 |
| Grant date | Feb 26, 1991 |
| Priority date | — |
| Expiry date | Oct 17, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.