Methods and apparatus for fabricating a high purity thermally-conductive polymer layer
US4997606A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1989 |
| Grant date | Mar 5, 1991 |
| Priority date | — |
| Expiry date | Oct 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/78
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicon rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silicone rubber layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.