IC card and method of manufacturing the same
US4997791A · kind A · utility
12Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1990 |
| Grant date | Mar 5, 1991 |
| Priority date | — |
| Expiry date | Apr 13, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.