Thermosetting resin composition useful for forming insulating layer of multilayer printed wiring board
US4997863A · kind A · utility
6Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1989 |
| Grant date | Mar 5, 1991 |
| Priority date | — |
| Expiry date | Aug 24, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0376
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed circuit board is disclosed which includes an aromatic epoxy resin having at least two epoxy groups, an aromatic polyamine mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.