High temperature resistant fast soldering wire enamel
US4997891A · kind A · utility
4Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1989 |
| Grant date | Mar 5, 1991 |
| Priority date | — |
| Expiry date | Sep 6, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/294
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solderable polyurethane wire enamel composition comprising a mixture of a blocked isocyanate and polyesterimide resin wherein the ratio of isocyanate groups in the blocked isocyanate to hydroxyl groups in the polyesterimide resin is about 0.82:1 to about 5.7:1 and the hydroxyl to carboxylic acid ratio of the raw materials used in preparing the polyesterimide is about 1.4:1 to about 2.5:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.