Method of attaching electronic components
US4998342A · kind A · utility
23Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1989 |
| Grant date | Mar 12, 1991 |
| Priority date | — |
| Expiry date | Aug 31, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.