Patent · US Expired

Method of bonding plastics

US4999069A · kind A · utility

25Cited by
23References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 2, 1989
Grant dateMar 12, 1991
Priority date
Expiry dateJun 2, 2009

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1064
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method of producing a fluidic module from two or more pieces (B.sub.1 B.sub.2) of plastic material having an intermolecular bonded interface, comprises forming an interface surface (2) on each piece, forming at least one fluidic passageway (4) in at least one of the interface surfaces, assembling the pieces with the interface surfaces in contact with each other and confining them against expansion. Heat is applied to the assembled pieces to induce their expansion against total or limited confinement to cause transmigration of molecules from one interface surface to the other to bond the pieces together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.