Method for treating polyetherimide substrates and articles obtained therefrom
US4999251A · kind A · utility
11Cited by
12References
11Claims
0Family size
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Key dates
| Filing date | Apr 3, 1989 |
| Grant date | Mar 12, 1991 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method is provided for treating the surface of a polyetherimide substrate to improve its adhesion characteristics for electrolessly deposited metal, such as copper. There is employed a series of surface treatments including the initial immersion of the polyetherimide substrate in sulfuric acid, contact with aqueous base, such as potassium hydroxide, followed by oxidation with an alkali metal permanganate such as potassium permanganate, and surface treatment with a reducing agent, such as a hydroxylamine salt. Polyetherimide metal composites are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.