Positive type photosensitive resinous composition with 1,2 quinone diazide sulfonyl unit
US4999274A · kind A · utility
5Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1988 |
| Grant date | Mar 12, 1991 |
| Priority date | — |
| Expiry date | Oct 27, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides a positive type photosensitive resinous composition comprising a resin obtained by the reaction of a polyepoxide compound, an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) and 1,2-quinondiazido sulfonic acid halide with the use of those three components in a defined proportion, which is useful for microfabrication photo-resist and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion to supporting substrates, when developed, non-exposed area are extremely resistive toward swelling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.