Apparatus for microwave heating test coupons
US4999469A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1990 |
| Grant date | Mar 12, 1991 |
| Priority date | — |
| Expiry date | Apr 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/707
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A test bonding apparatus comprising a rectangular wave-guide having a first pair of spaced opposing side walls attached to an orthogonal pair of spaced opposing side walls which are relatively wider. The waveguide includes an input portion, an intermediate bonding chamber portion and a terminating end portion which disposed in communication with one another. Coupled to the input portion is a microwave source and a coolant source for propagating consistently through the bonding chamber portion microwave energy having a predominant frequency associated with a predetermined wavelength, and a flow of coolant fluid. The relatively wider side walls in the bonding chamber portion of the waveguide have disposed along their longitudinal centerlines respective aligned slots. Each of the slots has opposing longitudinal edges disposed adjacent open ends of respective quarter wavelength chokes which are supported externally of the waveguide. Thus, a high impedance is established at each of the slots for preventing leakage of microwave energy therefrom. Within the bonding chamber portion, an aligned pair of dielectric clamping plates are supported by respective dielectric grid-like structures wh…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.